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Thermal-Floor-Panel-744

THERMAL FLOOR PANEL 744

Thermal Floor Panel 744 is a composite insulation and chipboard flooring panel designed for use on concrete floor bases.

Thermal Floor Panel 744 is suitable for new and refurbished buildings, conservatories and extensions using a variety of insulants.

Consisting of a moisture resistant chipboard factory-bonded to a thermal insulation layer to improve thermal performance through the floor structure.

Category:

Description

Thermal Floor Panel 744

Specification

  • Easy to cut and install
  • One operation saves time
  • Ready for floor covering
  • Excellent thermal insulation

Sizes

  • Expanded Polystyrene Thickness: 20mm, 25mm, 50mm
  • PIR Thickness: 20mm, 25mm, 50mm
  • Chipboard Thickness: 18mm or 22mm
  • Panel Size: 600mm x 2400mm

Other insulant thicknesses are available

Product Performance

Compression Strength | Thermal Conductivity

  • Expanded Polystyrene 70 kPa | 0.038 W/mK
  • PIR 140 kPa | 0.023 W/mK

Chipboard

  • C4 V313 Moisture Resistant Grade
  • Thermal Conductivity: 0.14 W/mK

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